产品特性（FEATURES）

1. ◆使用Window’s视窗介面，中/英文化书面，操作简单。
2. ◆手动量测锡膏厚度
3. ◆手动测量长、宽及两锡膏间之距离（间距）
4. ◆测量值可记录存档及列印
5. ◆提供厚度分布统计图表及X_Bar_R管制表
6. ◆自动计算制程能力指标CP、CPK、CPM
7. ◆可依不同生产线分别作记录
8. ◆可依基板厚度调整焦距
9. ◆可做定时呼叫取样
10. ◆All operations are easy and using Windows interface in Chinese/English version.
11. ◆Survey thickness of tin solder by auto matica lly or manually.
12. ◆Survey the length and width manually,and the gap of tin solder.
13. ◆Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.
14. ◆All surveyed values can be recorded to a file and be printed to a report.
15. ◆Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.
16. ◆Calculate man facture ability degree automatically(CP, CPK, CPM)
17. ◆It can have proprietary record according to every different production ling.
18. ◆It can adjust focus point in different thickness of PC boards.
19. ◆It can be called to sample periodically.
    
     

适用（APPLECATION）

1. ◆各式厚度量测数值取得统计分析
2. ◆锡膏印刷机制程品管检查
3. ◆锡膏印刷厚度良性测量
4. ◆锡膏印刷成型，尺寸量测检查
5. ◆提供其他物品测厚，测长，量测检查
6. ◆Get the results of statistics and analysis about all surveyed values in every thickness degree.
7. ◆Inspect the quality of solder printing process.
8. ◆Survey the thickness benignancy of tin solder
9. ◆Measure the dimension of tin solder
10. ◆Provide thickness and dimension measurement function for other objects
    
     

功能（FUNCTION）

1. ◆量测印刷锡膏厚度、长度、高度、间距。
2. ◆提供厚度分布数值参考。
3. ◆提供各种统计分析图表
    
4.   X管制图、 R管制图、厚度列表
     X平均值管制图 单点列表
5. ◆Surveying the thickness of printing tin solder, length ,height and interval.
6. ◆Provide the references of thickness distribution values.
7. ◆Provide the analysis of different measure of cross-section.
8. ◆Calculate the measure of area and volumn automatically in object which to be surveyed.
9. ◆Provide all diagrams of statistics and analysis.

  Provide X control Diagram, R Control Diagram
  and Thickness List Diagram. Provide X Average
  Control Diagram, Single Point List Diagram.