柔性线路板

产品描述

PCB Producing Capability
Item			Producting Capability
Layers			2-8
PCB thickness			Max.:3.5mm
			Min.:0.2mm
Panel Size			Max.:> 540MM
			Min.:>100mm
Drilling			Min.:0.25mm
			Max.:6.35mm
Immersion Copper			Max. 25.4UM
dry film hole sealing capacity			Max.Hole(5.0mm) slot(5.0*3.0mm)
Etching Tolerance			Min.:±20% or ±1mil
Line			Line width Min.:4mil
			Line space Min.:4mil
Electroplating	copper thickness of PTH		12UM(min),25.4(max)
	electroplating Au	Ni	100U“
		Au	0.6-1.5U"
	Immersion Au	Ni	100-250U"
		Au	1-3U"
	Immersion Ag		8-10U"
	Immersion Pb		0.8-1.0UM
	electroplating Pin	Ni	100U"
		Au	2-10U"
solder resist	Width		Min.:4MIL
	Space		3MIL
	Hole		Max.0.5MM
Outline Tolerance			Min.:±5MIL（0.13MM)
Surface finish			HASL, Immersion Silver/Gold/Tin OSP, Plating Gold

付款方式︰	TT