8L Immersion Gold +Gold Finger+ BGA PCB, Multilayer PCB
PCB Lamination: FR4 High Tg(Tg170)
Surface treatment: EING
PCB thinkness: 3.2mm
Min. Line width/space: 3/3 mil
Min. Hole: 0.2mm
Blind& Buried Holes
Impedence control
E-test 100% Fixture, vacuum packing
Quality report, Solderability test, E-test report, Final inspection, RoHS Compaint