LOCTITE 384是一種單組分、可維修型導熱膠粘劑，在室溫下可用活化劑固化,促進劑固化,丙烯酸脂,用於需要拆卸的部件,將變壓器,晶體管和其它發熱元件粘接到印刷電路板或散熱器上.

外觀:白色膏體; 比重@25°C:1.64;閃點(TTC) °C:>93
導熱係數：0.757W/MK

LOCTITE® 384™ is a thermally conductive adhesive system
designed for bonding heat generating components to heat
sinks. The high thermal conductivity provides excellent heat
dissipation for thermally sensitive components, while the
controlled strength permits field and service repair. In high pot
applications this product should be limited to a maximum of
500 volts. Typical applications include bonding transformers,
transistors and other heat generating electronic components to
printed circuit board assemblies or heat sinks.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.64
Flash Point - See MSDS
Viscosity, Brookfield - HBT, 25 °C, mPa·s (cP):
Spindle TE, speed 2.5 rpm, Helipath 500,000 to 2,250,000LMS
Spindle TE, speed 20 rpm, Helipath 300,000 to 800,000LMS
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion, ISO 11359-2, K-1 69×10-6
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
0.757
Elongation, at break, ISO 527-3, % 0.9
Tensile Strength, at break, ISO 527-3 N/mm² 13
(psi) (1,800)
Young's Modulus N/mm² 2,800
(psi) (400,000)
Electrical Properties:
Volume Resistivity, IEC 60093, Ω·cm 1.3×1012
Surface Resistivity, IEC 60093, Ω 5.1×1013
Dielectric Breakdown Strength, IEC 60243-1, kV/mm 26.7
Dielectric Constant / Dissipation Factor, IEC 60250:
100-Hz 6.48 / 0.1
1-kHz 5.86 / 0.04
1-MHz 5.22 / 0.03