3014(晶元)芯片燈珠

3014(晶元)芯片燈珠
型號:3014
品牌:晶元
原產地:臺灣 中國
類別:電子、電力 / 其它電力、電子
標籤︰3014貼片燈珠
單價: ¥100 / K
最少訂量:2 K

產品描述

產品介紹:

產品尺寸圖:

 

PART NO. (型號)

CHIP

Lens Color

Material

Source Color

3014白光

ALInGaP

White(白色)

yellow(黃色)

 

Notes:

1.        All dimensions 1.所有單位是毫米(英吋)

2.允許誤差為正負0.25mm,除非另行通知。

3.規格可能隨時有變化,不另行通知。

4.本數據有效期為六個月

Absolute Maximum Ratings at TA=25℃

 

Parameter(參數)

Valce(標準值)

Unit(單位)

Power Dissipation(消耗功率)

120

mW

Pilsed  Forward Current(脈衝順向電流)

(1/10 Duty Cycle, 0.1ms Pulse width

100

mA

Continuous Forward Current(連續工作電流)

30

mA

Derating Linear From 50℃(電流比例關係)

0.4

mA /℃

Reverse Voltage(反向電壓)

5

V

Operation Temperature Range(工作溫度)

-40℃ to +80℃

Storage Temperature Range(儲存溫度)

-40℃ to +80℃

Lead Soldering Temperature

[4mm (.157”) From Body](焊接溫度)

260℃ for 5 Seconds(260度下不超過5秒)

 

 

Electrical / Optical Characteristics at TA=25℃

 

Parameter(參數)

Symbol標誌

Min. 最小值

Typ. 中間值

Max. 最大值

Unit單位

Test Condition測試條件

Luminous Intensity(光通量)

  Φ

10

11.5

14

Lm

IF=30mA Note 1.4

Source color(發光顏色)

CCT

6000

 

6500

K

IF=30mA Note4

Viewing Angle(發光角度)

2θ1/2

115

120

125

deg

Note 2

Forward Voltage(正向電壓)

VF

3.0

3.2

3.4

V

IF=30mA

Reverse Current(反向電流)

IR

-

-

5

μA

VR=5V

 

Note1.Luminous intensity is measured with a light sensor and filter combination that approximates the CIE (Commission International De L’Eclairage) eye-response curve.

      2.1/2 is the off-axis angle at which the luminous intensity is half the axial luminous and intensity.

     3.The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

       4.The IV guarantee should be added ±15%.

 

 

                                       特性曲線圖

 

Forward Current                                 Relative Luminous Intensity

IF = f (VF); TA = 25 °C                                     IV/IV(30mA) = f (IF); TA = 25 °C

Reflow Soldering Instructions (回流焊說明)

1.Number of reflow process shall be less than 2 times and cooling

process to normal temperature is required between first and Second soldering process.

(本產品最多只可回焊兩次,且在首次回焊后須冷卻至室溫之後方可進行第二次回焊.)

2.When soldering, do not put stress on the LEDS during heating.(高溫焊接時,不能外加壓力在LED上.)

3.After soldering,do not warp the circuit board.(焊接完成后,不能彎曲線路板.)

1>Lead Solder(有鉛回焊)

Recommended Soldering Patter (n推薦焊盤式樣)

(單位:毫米)

3014(晶元)芯片燈珠 1

會員信息

深圳市宇亮光電技術有限公司
國家/地區︰广东省深圳市
經營性質︰生產商
聯繫電話︰13699813679
聯繫人︰邱敏 (業務經理)
最後上線︰2013/11/06