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JT SPI-REFINE系列技術參數/JT SPI-REFINE Series Specifications |
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設備型號/Model: |
REFINE-M |
RRFINE-L |
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檢測模塊/Inspection Module: |
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相機配置/Camera Specification |
4百萬像素工業相機，超高幀數(出廠時設定) 4M High-frequency Industrial Camera, High Frame Number (Factory Setting) |
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像素大小/Pixel |
20um, 15um(Factory Setting) |
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FOV（單個視野）範圍 |
40x40mm, 30x30mm(Factory Setting) |
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燈源/LED |
RGB+TOP |
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高度檢測範圍/Height Range |
0 - 550 um |
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高度檢測分辨率/Height Resolution |
0.36 um |
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高度檢測精度/Height Accuracy |
1um（基於實際錫膏/校正塊 Based on the actual solder paste/calibration block） |
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檢查項目/Inspection Item |
體積、面積、高度、XY位置、形狀等 /Volume, Area, Height, X/Y Position, Bridging, Shape, etc |
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不良種類/Defection Types |
多/少錫、漏印、錫膏拉尖，橋連、偏移、異行、沾污等/Excessive/Insufficient/missing paste, Bridge 2D&3D,Paste displacement, Shape deformity, Dust, etc |
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體積、高度、面積測量重複性/ Repeatability (Volume, Area, Height) |
＜1%@3sigma |
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GR&R (Gauge Reproducebility and Repeatability) |
＜10%（@6sigma tolerance = +/-50%） |
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測試速度/Inspection Speed |
0.3S/FOV |
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軌道與PCB尺寸/Conveyor & PCB Size: |
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最大板尺寸/Max PCB Size |
330×250 mm |
510×510 mm |
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最小板尺寸/Min PCB Size |
50×50 mm |
50×50 mm |
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PCB上方淨高/PCB Up-Clearance |
30 mm |
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PCB下方淨空/PCB Bottom-Clearance |
30 mm |
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可適應PCB厚度/PCB Thickness |
0.3 - 5mm |
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PCB最大彎曲/Max PCB Warpage |
±3mm |
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元件至板邊最小距離/PCB Transfer Height |
2.5mm |
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軌道高度範圍/PCB Transfer Height |
900±20mm |
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最大板重量/Max PCB Weight |
5kg |
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框架與其他/Frame & Others: |
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底座與框架/Base & Frame |
整體鑄鐵底座框架，整體成型，堅固穩定/Integral Steel casting frame, firmly, ensure the high accuracy of Inspection |
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設備長寬高與重量/System Dimensions and Weight |
885×1090×1600 mm (W×D×H), 950 kg |
1060*1310*1600 mm (W×D×H), 1200 kg |
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電源/Power Supply |
220V單相/Single phase, 50/60 HZ,3 kwh |
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通訊界面/Communication Interface |
SMEMA |
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氣源/Air Supply |
4-6 bar, 5 L/min |
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操作溫度與濕度/Operating Condition |
5-40 ℃，15-90%RH |
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選配件/Options： |
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1、BarCode識別器/Barcode Reader |
4、維修站(含計算機)/Repair Station(PC) |
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2、3D校正塊/3D Calibration Target |
5、人機交換系統(電容觸摸LCD顯示器+聲控)/ Infared Muti-touch LCD+Voice control |
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3、2D校正玻璃/2D Calibration Glass |
6、離線編輯軟件(含加密鎖)/Offline editing software(License key) |
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