Technoorg Linda Ion Miller
Gentle Miller for TEM and SEM sample preparation
(1) Full PC program control.
(2) Focus low energy gun (100ev to 2kev, 7–90 μA, variable, continuously adjustable) still with low and high etching (Highest thinning rate (Si/30°) : 28μm/h ) for artifact free sample preparation.
(3) Largest TEM observation (30–200 μm, ~100um2)
(4) electronically adjustable milling angle from 0° to 45° in 0.1° increments.
(5) computer-controlled specimen rotation and oscillation from 0° to 120° in 10° increments.
(6) Load lock design.
(7) CCD camera image for real-time visual control (up to 400×magnification).
(8) Original Pfeiffer computer-controlled vacuum system with oil-free membrane and turbo molecular pumps, equipped with compact full-range vacuum gauge (combined Pirani and Penning heads).

IV3 and IV4 Miller for TEM and SEM sample preparation
(1) Dual Gun design
(2) Regular Gun -TELETWIN (2-10 Kev)-Highest thinning rate (Si/30°): 200 μm/h
High Energy Focus Gun (2-10 Kev)-Highest thinning rate (Si/30°): 350 μm/h
Low Energy Focus Gun -Hot cathode (100~2000ev)-Highest thinning rate (Si/30°): 28 μm/h
(3) Largest TEM observation (30–200 μm, ~100um2)
(4) Specimen rotation and oscillation from 0° to 90°.
(5) Load lock design for IV4.
(6) Retard field design for small angle incident.
(7) Stereo OM for real-time visual control. Option CCD camera monitor.
(8) Original Pfeiffer computer-controlled vacuum system with oil-free membrane and turbo molecular pumps, equipped with compact full-range vacuum gauge (combined Pirani and Penning heads).