Environment
‰ Voltage Supply Class A, B, C: 1.62V to 5.5V
‰ -25 to +85 0C Operating Temperature
‰ Max supply current 10mA @ 40MHz, Class A
‰ Max supply current 6mA @ 40MHz, Class B
‰ Max supply current 4mA @ 40MHz, Class C
‰ > 4 kV ESD Protection HBM
CPU
‰ Software compatible CMOS 80X51 industry standard
‰ Accelerated core with 16 bit CPU performance level
‰ Up to 40 MHz internal CPU clock
Idle Modes
‰ Idle and Stop mode selectable modes
‰ NVM update operation with CPU in idle mode
‰ IO Transmission and Reception with CPU in idle mode
‰ Max Idle current / Clock stopped: 100 uA
Security
‰ Hardware Random Number Generator ‰ Unique chip identification number
‰ Notification of tampering
‰ IC operates under regulated voltage and internal clock
‰ Under / Over voltage sensors (Vcc)
‰ Secured layout against probing attacks
Memory Control
‰ General Purpose Non Volatile Memory: GPNVM
‰ Secure Memory Management Mechanism
‰ Fast Byte program
‰ GPNVM Page Smart Erase mechanism
I/O
‰ ISO 7816-3 compliant electrical interface
‰ ISO 7816-3 compliant reset and response T=0 and T=1 protocols
‰ Software controllable pull-up on IO
‰ ETU Timer/Counter replacing 8051 T0/T1 Timers
‰ ETU Timer prescaler for FIDI independant delays
‰ CRC16 Module ISO3309 compatible
Memories
‰ Local RAM (data, idata) = 256 B
‰ XRAM (xdata) 3328B
‰ GPNVM USER 128KB
‰ GPNVM SYSTEM 4KB
‰ 10 year data retention GPNVM
‰ GPNVM Endurance > 100 K cycles
Firmware configuration
‰ Boot loader GNG and T=0 compatible
‰ Fast Boot loader up to 32KB/s
‰ In option erasable Test OS option
Delivery forms
‰ Inkless wafer based on e-map files
‰ 8” Wafer sawn on frame
‰ Back grinding and distressing options
‰ UV tape option
‰ 150um thickness
‰ 8-pins or 6-pins Modules
Typical Application:
‰ Native CDMA / GSM / RUIM / UICC OS 64KB
‰ Software compatibility with EMTGxx
