Wet blast media is frequently used in electronic industry to remove flash and burr from leadframe that are created during chips encapsulated by resin on leadframe.

Wet blast media mixed with water to impact on substrate in a wet blast machine, the presence of water provides a lubricating cushion between aggressive media and delicate object.  The lubricating cushion can protect both media and object from excess damage.

Our wet plastic medias are produced by full cured and modified thermoset resins.  It is harder and denser than other plastic medias resulting in more efficient deflashing, superior sedimentation and excellent media circulation.  We mane the wet plastic media as abbreviation of WPM.

Beside WPM, our wet blast media family is contained 2 additional types as WPB and WGB.  They provide a choice for users on different media density and hardness that are specified as below: 

Except wet blast medias, we supply wet blast machine also.  It is right presented in this movie as below.