Lead Free Solder Paste

Model:	KY805A Series
Brand:	-
Origin:	Made In China
Category:	Chemicals / Adhesives & Sealants
Label:	Solder Paste , Lead free paste , solder scream
Price:	-
Min. Order:	20 pc

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Product Description

Product Detail:

KY805A series lead free solder cream is a no-clean solder paste which use in SMT production processing. It is designed with the compound of low oxide contained spherical alloy solder powder and special solder paste and has good printability. Moreover, in order to reach the excellent insulation and residual resistance and make sure the reliability of the “no-clean” efficiency after back welding our product is specially designed with the high reliability low ionic
activator system.In order to match different production processing requirement we could adjust the quantity of the alloy, powder and other metallic materials.

Specification:

Testing standard and methods:ANSI/J-STD-004/005/006;SZ3197-86;ISZ 3283-86;PC-TM-650

Composition Analysis

Item	Composition	Value
1	Tin( Sn）%	99±0.5
2	Silver（A g）%	0.3±0.05
3	Copper（Cu）%	0.7±0.02
4	Lead（Pb）%	≤0.10
5	Stibium（Sb）%	≤0.02
6	Bismuth（Bi）%	≤0.10
7	Steal（Fe）%	≤0.02
8	Arsenic（As）%	≤0.03
9	Zinc（Zn）%	≤0.002
10	Aluminum（Al）%	≤0.002
11	Cadmium (Cd) %	≤0.002
12	Nickel(（Ni）%	≤0.005
Notes: All the above metallic material quantity of the alloy solder powder could be check in quality inspection document and accord with J-STD-00 standard

Tin particle size distribution and Alloy physical properties

Number	Diameter（UM）	Application Distance	Melting Point 217～218℃
2#	45～75	≥0.65mm(25mil)	Alloy Specific Gavity	7.4g/cm3
2.5#	25～63	≥0.65mm(25mil)	Hardness	15HB
3#	25～45	≥0. 5mm(20mil)	Thermal Conductivity	64J/M.S.K
4#	20～38	≥0.4mm(16mil)	Tensile Strength	52Mpa
5#	15～38	≥0.4mm(16mil)	Elongation	27%
6#	10～30	Micro BGA	Conductivity	14%of IACS