AlN-AF series is the grade with high purity and without surface modification for special application which low iron content is required.

Customized size distribution for specific applications is welcomed.

 Applications： 

 •  Aluminum nitride substrate

 •  MCPCB thermal filler

 •  Epoxy molding compound (EMC) additives

 •  Thermal paste / Thermal plastic

 •  Thermal interface materials

 •  Other thermal management solutions

 Product  Features：

•  Sharp size distribution

•  Good dispersion

•  Low metal impurities

•  Low oxygen contents

•  Low CTE (Coefficient of Thermal Expansion)

•  Diversity selection in size ( 2 um - 20 um )

•  Custom size option available

 Product package:

•  0.1kg sample package

•  10 kg volume package