Diamond cutting wire for silicon wafer

1,Saving materials

Diamond cutting crack is small and rate of piece is high, it can reach 90%, saving material greatly.

2,Cutting precision

Accuracy of cutting material can be achieved, and the surface is smooth, it can be polished directly after cutting, eliminating the grinding process, saving time and materials.

3,Cutting speed

Diamond cutting wire cutting speed is faster, greatly improving the work efficiency.

4,No collapse

While cutting a variety of hard and brittle material, collapsing edges are less than 10mm, can be avoided easily give rise to the inner circle cutting edge or the bottom of the crack.

5,Reduce environmental pollution

Cutting by water cutting, can prevent pieces of powder pollution and maintain the working environment of materials and equipment clean.