Leading products: cerium oxide polishing leather, polyurethane polishing pad resistance Neeb polishing leather, the CMP polished wafer carrier.
                    
        Japan Technology, Taiwan production, factory direct absolute advantage of the domestic and international prices:
        Perfect alternative LP66, LP77, LP26, LP57, IC1010, KSP imports CMP polished wafers

Used to ● precision optics ● flat glass / LCD / FPD ● storage disk drives ● semiconductor ceramic substrate ● optical glass ● LED sapphire substrate ● crystal polishing field, a variety of materials can be polished workpiece, such as silicon, gallium arsenide, quartz crystal , sapphire, metal, glass, a semiconductor ceramic material.

PAD TYPE	FILLER	AVER	DENSITY(g/cm3)	JIS-A
SH66/77	CeO2	23-25%	0.45	77-80
SH57	Unfilled	Unfilled	0.62	95
SH85	Fe2O3	7.7%	0.66	87

        The main specifications of the product are: 1400×650（mm）, 1400×700（mm）, 640×640（mm），700×700（mm）, 850×850(mm), 900×900（mm）, 1000×1000（mm）；The maximum diameter of the circular piece can reach ¢1180（mm） and can be custom-tailored. The thickness ranges from 0.5mm to 5.0mm. Gum and groove are available.