Product Description
DOW CORNING TC - 5022 new thermal silicon grease, for high order microprocessor encapsulation provide high thermal efficiency and low holding costs, its thermal efficiency than the thermal conductivity of fat on market at present is on average 10% to 15%, applicable to all kinds of heat sink, including cost lower heat sink, so as to reduce the user's total manufacturing cost.
Member Information
| FOSHAN AISHA TECHNOLOGYCO.,LID |
| Country/Region: | Guang Dong - China |
| Business Nature: | Trading Company |
| Phone: | 13535637755 |
| Contact: | winnie wang (manager) |
| Last Online: | 25 Nov, 2017 |
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