TCPA3025A introduction

TCPA3025A for a high thermal conductivity ceramic material filling the clusters of phthalic amide (PPA) resin, can provide excellent heat transfer rate. This material with high heat resistance, could be applied to a wide temperature range, with low hygroscopic and excellent electrical properties. In addition, its high crystallization rate and high liquidity, can shorten the production cycle, and improve the product production efficiency. This is filled with aluminum nitride (ALN) after the compound and into the gray high thermal conductive materials, the heat conduction analyzer (HOT DISK) test the coefficient of thermal conductivity of 2.5 W / (m * k).