| Item |
Manufacture Capability |
| Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
| Layer No. |
1-16 |
| Finished Board thickness |
0.2 mm-3.8mm’ (8 mil-150 mil) |
| |
| Board Thickness Tolerance |
± 10% |
| Cooper thickness |
0.5 OZ-11OZ (18 um-385 um) |
| Copper Plating Hole |
18-40 um |
| Impedance Control |
± 10% |
| Warp& Twist |
0.70% |
| Peelable |
0.012" (0.3mm)-0.02’ (0.5mm) |
| Images |
| Min Trace Width (a) |
0.1mm (4 mil) |
|
| Min Space Width (b) |
0.1mm (4 mil) |
| Min Annular Ring |
0.1mm (4 mil) |
|
| SMD Pitch (a) |
0.2 mm(8 mil) |
|
| BGA Pitch (b) |
0.2 mm (8 mil) |
| |
|
| Solder Mask |
| Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
|
| Soldermask Clearance (b) |
0.1mm (4 mil) |
| Min SMT Pad spacing (c) |
0.1mm (4 mil) |
| Solder Mask Thickness |
0.0007" (0.018mm) |
| Holes |
| Min Hole size (CNC) |
0.2 mm (8 mil) |
| Min Punch Hole Size |
0.9 mm (35 mil) |
| Hole Size Tol (+/-) |
PTH: ± 0.075mm; NPTH: ± 0.05mm |
| Hole Position Tol |
± 0.075mm |
| Plating |
| HASL |
2.5um |
| Lead free HASL |
2.5um |
| Immersion Gold |
Nickel 3-7um Au: 1-5u' ' |
| OSP |
0.2-0.5um |
| Outline |
| Panel Outline Tol (+/-) |
CNC: ± 0.125mm, Punching: ± 0.15mm |
| Beveling |
30° 45° |
| Gold Finger angle |
15° 30° 45° 60° |
| Certificate |
ROHS, ISO9001: 2008, SGS, UL certificate |
| Item |
Manufacture Capability |
| Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
| Layer No. |
1-16 |
| Finished Board thickness |
0.2 mm-3.8mm’ (8 mil-150 mil) |
| |
| Board Thickness Tolerance |
± 10% |
| Cooper thickness |
0.5 OZ-11OZ (18 um-385 um) |
| Copper Plating Hole |
18-40 um |
| Impedance Control |
± 10% |
| Warp& Twist |
0.70% |
| Peelable |
0.012" (0.3mm)-0.02’ (0.5mm) |
| Images |
| Min Trace Width (a) |
0.1mm (4 mil) |
|
| Min Space Width (b) |
0.1mm (4 mil) |
| Min Annular Ring |
0.1mm (4 mil) |
|
| SMD Pitch (a) |
0.2 mm(8 mil) |
|
| BGA Pitch (b) |
0.2 mm (8 mil) |
| |
|
| Solder Mask |
| Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
|
| Soldermask Clearance (b) |
0.1mm (4 mil) |
| Min SMT Pad spacing (c) |
0.1mm (4 mil) |
| Solder Mask Thickness |
0.0007" (0.018mm) |
| Holes |
| Min Hole size (CNC) |
0.2 mm (8 mil) |
| Min Punch Hole Size |
0.9 mm (35 mil) |
| Hole Size Tol (+/-) |
PTH: ± 0.075mm; NPTH: ± 0.05mm |
| Hole Position Tol |
± 0.075mm |
| Plating |
| HASL |
2.5um |
| Lead free HASL |
2.5um |
| Immersion Gold |
Nickel 3-7um Au: 1-5u' ' |
| OSP |
0.2-0.5um |
| Outline |
| Panel Outline Tol (+/-) |
CNC: ± 0.125mm, Punching: ± 0.15mm |
| Beveling |
30° 45° |
| Gold Finger angle |
15° 30° 45° 60° |
| Certificate |
ROHS, ISO9001: 2008, SGS, UL certificate |
| Item |
Manufacture Capability |
| Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
| Layer No. |
1-16 |
| Finished Board thickness |
0.2 mm-3.8mm’ (8 mil-150 mil) |
| |
| Board Thickness Tolerance |
± 10% |
| Cooper thickness |
0.5 OZ-11OZ (18 um-385 um) |
| Copper Plating Hole |
18-40 um |
| Impedance Control |
± 10% |
| Warp& Twist |
0.70% |
| Peelable |
0.012" (0.3mm)-0.02’ (0.5mm) |
| Images |
| Min Trace Width (a) |
0.1mm (4 mil) |
|
| Min Space Width (b) |
0.1mm (4 mil) |
| Min Annular Ring |
0.1mm (4 mil) |
|
| SMD Pitch (a) |
0.2 mm(8 mil) |
|
| BGA Pitch (b) |
0.2 mm (8 mil) |
| |
|
| Solder Mask |
| Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
|
| Soldermask Clearance (b) |
0.1mm (4 mil) |
| Min SMT Pad spacing (c) |
0.1mm (4 mil) |
| Solder Mask Thickness |
0.0007" (0.018mm) |
| Holes |
| Min Hole size (CNC) |
0.2 mm (8 mil) |
| Min Punch Hole Size |
0.9 mm (35 mil) |
| Hole Size Tol (+/-) |
PTH: ± 0.075mm; NPTH: ± 0.05mm |
| Hole Position Tol |
± 0.075mm |
| Plating |
| HASL |
2.5um |
| Lead free HASL |
2.5um |
| Immersion Gold |
Nickel 3-7um Au: 1-5u' ' |
| OSP |
0.2-0.5um |
| Outline |
| Panel Outline Tol (+/-) |
CNC: ± 0.125mm, Punching: ± 0.15mm |
| Beveling |
30° 45° |
| Gold Finger angle |
15° 30° 45° 60° |
| Certificate |
ROHS, ISO9001: 2008, SGS, UL certificate |
| Item |
Manufacture Capability |
| Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
| Layer No. |
1-16 |
| Finished Board thickness |
0.2 mm-3.8mm’ (8 mil-150 mil) |
| |
| Board Thickness Tolerance |
± 10% |
| Cooper thickness |
0.5 OZ-11OZ (18 um-385 um) |
| Copper Plating Hole |
18-40 um |
| Impedance Control |
± 10% |
| Warp& Twist |
0.70% |
| Peelable |
0.012" (0.3mm)-0.02’ (0.5mm) |
| Images |
| Min Trace Width (a) |
0.1mm (4 mil) |
|
| Min Space Width (b) |
0.1mm (4 mil) |
| Min Annular Ring |
0.1mm (4 mil) |
|
| SMD Pitch (a) |
0.2 mm(8 mil) |
|
| BGA Pitch (b) |
0.2 mm (8 mil) |
| |
|
| Solder Mask |
| Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
|
| Soldermask Clearance (b) |
0.1mm (4 mil) |
| Min SMT Pad spacing (c) |
0.1mm (4 mil) |
| Solder Mask Thickness |
0.0007" (0.018mm) |
| Holes |
| Min Hole size (CNC) |
0.2 mm (8 mil) |
| Min Punch Hole Size |
0.9 mm (35 mil) |
| Hole Size Tol (+/-) |
PTH: ± 0.075mm; NPTH: ± 0.05mm |
| Hole Position Tol |
± 0.075mm |
| Plating |
| HASL |
2.5um |
| Lead free HASL |
2.5um |
| Immersion Gold |
Nickel 3-7um Au: 1-5u' ' |
| OSP |
0.2-0.5um |
| Outline |
| Panel Outline Tol (+/-) |
CNC: ± 0.125mm, Punching: ± 0.15mm |
| Beveling |
30° 45° |
| Gold Finger angle |
15° 30° 45° 60° |
| Certificate |
ROHS, ISO9001: 2008, SGS, UL certificate |
| Item |
Manufacture Capability |
| Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
| Layer No. |
1-16 |
| Finished Board thickness |
0.2 mm-3.8mm’ (8 mil-150 mil) |
| |
| Board Thickness Tolerance |
± 10% |
| Cooper thickness |
0.5 OZ-11OZ (18 um-385 um) |
| Copper Plating Hole |
18-40 um |
| Impedance Control |
± 10% |
| Warp& Twist |
0.70% |
| Peelable |
0.012" (0.3mm)-0.02’ (0.5mm) |
| Images |
| Min Trace Width (a) |
0.1mm (4 mil) |
|
| Min Space Width (b) |
0.1mm (4 mil) |
| Min Annular Ring |
0.1mm (4 mil) |
|
| SMD Pitch (a) |
0.2 mm(8 mil) |
|
| BGA Pitch (b) |
0.2 mm (8 mil) |
| |
|
| Solder Mask |
| Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
|
| Soldermask Clearance (b) |
0.1mm (4 mil) |
| Min SMT Pad spacing (c) |
0.1mm (4 mil) |
| Solder Mask Thickness |
0.0007" (0.018mm) |
| Holes |
| Min Hole size (CNC) |
0.2 mm (8 mil) |
| Min Punch Hole Size |
0.9 mm (35 mil) |
| Hole Size Tol (+/-) |
PTH: ± 0.075mm; NPTH: ± 0.05mm |
| Hole Position Tol |
± 0.075mm |
| Plating |
| HASL |
2.5um |
| Lead free HASL |
2.5um |
| Immersion Gold |
Nickel 3-7um Au: 1-5u' ' |
| OSP |
0.2-0.5um |
| Outline |
| Panel Outline Tol (+/-) |
CNC: ± 0.125mm, Punching: ± 0.15mm |
| Beveling |
30° 45° |
| Gold Finger angle |
15° 30° 45° 60° |
| Certificate |
ROHS, ISO9001: 2008, SGS, UL certificate |
Layers: 1 to 10
Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free, FR-1 and FR-2
Board thickness: 0.2 to 4mm
Maximum finished board side: 800 x 508mm
Minimum drilled hole size: 0.25mm
Minimum line width: 0.075mm (3mil)
Minimum line spacing: 0.075mm (3mil)
Surface finish/treatment: HALS/HALS lead-free, chemical tin/gold, immersion gold/silver/OSP and gold plating
Copper thickness: 0.5 to 4.0oz
Solder mask colors: Green/black/white/red/blue/yellow
Inner packing: Vacuum packing and plastic bag
Outer packing: Standard carton packing
Hole tolerance:
PTH: 0.076
NTPH: 0.05
Certificates: UL, ISO 9001, ISO 14001, RoHS and CQC
Profiling: Punching, routing, V-cut and beveling
OEM services are provided to all sorts of printed circuit board assembly
We are a professor in this line for over 12 years, please feel free to place an order.
