Insulation White Ingun Board

Model:	-
Brand:	Honglei Insulation White Ingun Board
Origin:	Made In China
Category:	Electronics & Electricity / Electronic Components / Circuit Board
Label:	antistatic , fireproof insulation , electrical waterproo
Price:	US $1 / pc
Min. Order:	500 pc

Inquire Now

Product Description

Feature:

(1)low water absorption hardly deformed,

(2(high mechanical strength,

(3)dry state,

(4)good wet electrical properties,

(5)good flame-retardant (94V₀).

Name	Antistatic Ingun	Model No.	CEM-1
Backing material	insulating paper+epoxy resin		Density 1.55
Item	Test Method	Unit	Result
Fire Retardancy Grade	A	/	94V0
Dielectric Constant	C-96/20/65(in25°C oil)	KV/mm	10(OK)
Electrical Volume Resistivity	C-96/20/65	Ohm	5*1011-1012
Electrical Volume Resistivity	C-96/20/65 +C-96/40/90	Ohm	5*109-1011
Electrical Surface Resistivity	C-96/20/65	Ohm	5*1010-1012
Electrical Surface Resistivity	C-96/20/65 +C-96/40/90	Ohm	5*109-1011
Insulation Resistance	C-96/20/65	Ohm-cm	5*1010-1011
Insulation Resistance	C-96/20/65 +D-2/100	Ohm-cm	107-109
Permittivity(IMHZ)	C-96/20/65	/	4.0-5.0
Permittivity(IMHZ)	C-96/20/65 +D-48/50	/	4.5-5.5
Dielectric Dissipation factor(IMHZ)	C-96/20/65	/	0.035-0.045
Dielectric Dissipation factor(IMHZ)	C-96/20/65 +D-48/50	/	0.04-0.05
Bending strength(horizontal)	A	kg/mm2	12-17
Heat Resistance(120min)	A	°C	130
Impact intensity()	A	kg-cm/cm2	2.8-3.4
Adhesive strength	A	kg	400-550
Compressive strength(Vertical)	A	kg/mm2	29-34
Compressive strength(Horizontal)	A	kg/mm2	19-24
Water absorption rate	E-24/50 +D-24/23	%	0.12-0.16
	boiled	Min	30

Application:

1.It was commonly used in ICT, ITE fixture needle plate, carrier board and various functions of governance needle plate carrier board and a variety of anti-static requirements fixture or equipment. Surface of the plate is well-protected and accurate index processing performanceis good. And supporting the thin-shaped substrate or a flexible printed circuit board

2, the irregular shape of the substrate

3 can be used for multi-link plate, can carry bending phenomenon of wave soldering in order to increase productivity, preventing the substrate in the reflow generated has the temperature was gradually increasedenvironment, can still maintain .