Properties
Excellent in wire-bonding workability with excellent hot hardness.
Excellent in adhesion to copper foil or to adhesive agent
Excellent in insulation resistance.
Excellent in chemical resistance
Low temp. Curable (Max. 160C )
Compared with PI film, Excellent in demensional stability with proper stiffness

Applications
IC substrate for Smart cards
IC substrate for BGA, CSP or COB
Small size LCD driver substrate