No lead tin silver copper solder

High purity of lead-free solder is the company adopts high purity materials and unique melting process with antioxidant technology material casting and become, is to help you smooth transition to high-quality lead-free solder lead-free process. Applicable to PCB wave crest welding and hot dip, precision welding and high density surface. Characteristics of high purity electrode: the purity of the product is high, fluidity big, can enhance the diffusion capacity; wettability characteristics, has a good antioxidant capacity; tin slag less, tin, solder full, bright, uniform, rapidly improve production efficiency.

The physical, mechanical properties of the alloy.

The alloy composition.

The melting point (0C)

Density

The hardness of HV

Tensile strength

Scope of use

Sn96.5/Ag3.0/Cu0.5

2170C-2190C

7.37

14.1

32MPa

Wave soldering / hand dip

Sn99/Ag0.3/Cu0.7

2170C-2250C

7.34

14.1

32MPa

Wave soldering / hand dip

Sn99.3/Cu0.7

2170C-2270C

7.32

9

32MPa

Wave soldering / hand dip

Sn99.96

2000C-2200C

7.30

53.5

32MPa

Wave soldering / hand dip

The supply and demand sides can agree with adding other alloy composition of high purity solder