Specifications:

1.Printed Circuit Board Fabricate/Assembly
2.UL,SGS,ROHS Certificated
3.Competitive Price,High Quality
4.OEM are welcomed

Product descriptions:

2L special flex board
the surface is Hard gold for 15u
UL,SGS,ROHS Certificated
Competitive Price,High Quality

2layer special Flex board

Material : PI

Copper thickness: 0.5-7.0 oz

Board thickness: 0.21-7.0mm

Minimum Conductor width: 3mil

Minimum Conductor space: 3mil

Surface finish: Chem.Ni/Au, immersion Sn,/Silver,  OSP, Flash Gold, HASL Leadfree+gold finger, conductive carbon ink.  plating tin

Layer: 1-16 layer

Welcome To K.F PCB Factory

We are professional PCB manufacturer with ten years experiences .

Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.

We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working

hrs production time .

1.PCB Made Ability:

Item			Technical Standards
Rise			1-20 Layer
Material			FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
Thickness			0.2mm-3.2mm(8mil-126mil)
Minimum thickness			0.075mm(3mil)
Cu			1/2 oz min;5 oz max
Min line width/spacing			0.075mm/0.1mm(3mil/4mil)
Min drill hole			0.2mm(8mil)
Punching the smallest aperture			0.9mm(35mil)
Surface finish/treatment			HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
The largest size puzzle			610mm×508mm
Tolerance		Pore spaces	+/-0.075mm(3mil) CNC Driling
		Line width	+/-0.05mm(2mil) or
			+/-20% of original artwork
		Aperture	PTH L:+/-0.075mm(3mil)
			Non-PTH L:+/-0.05mm(2mil)
		Appearance Tolerance	+/-0.125mm(5mil) CNC Routing
			+/-0.15mm(6mil) by Punching
		Warp	0.70%
Insulation Resistance			10Kohm-20Mohm
Conduction Resistance			<50ohm
Test voltage			10-300V
MLB	Interlaminar deviation		4 layers:0.15mm(6mil)max
			6 layers:0.25mm(10mil)max

2.Detailed Terms for Pcb Assembly

Technical Requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

Production Requirement:

1) Gerber file and Bom list

2) PNP Files,clear pics needed for pcba

3) Testing method for products

3.Packaging & Delivery:

Packaging Details:	vacuum sealed packaging,silicagel inside
Delivery Detail:	Lead time according to order volum and board specifications