Lamination thickness: 0.8 to 1.6mm
Copper thickness: 0.5, 1.0 and 2.0oz
Minimum hole size: 0.80mm by punching, 0.6mm by drilling
Imaging: silk screen
Minimum line width: 0.2/0.25mm
Plating: nickel, flash, bondable gold, gold fingers, tin (hot air leveling/roll-tin)
Solder mask: UV and thermo curable
Options: carbon print (information), silver print, blue peelable mask, silver through hole, carbon and V-cut, plated through hole
Electrical tests: available
Outgoing quality checks: AQL 0.40 major 1.5 minor