Specifications:
Fast response for RFQ and prototyping build
Flexible production for customer required high-mix, low and medium volume
Simple, complicated boards and components available
High placement precision in ball-grid array (BGA), through-hole assembly
IPC-A-610E standards
Lead and lead-free process capability
With good supply chain management and production quality control
Provides contract electronics manufacturing services to all sorts of OEM printed circuit board assemblies as well as finished