US-730 machine apply to clean SMT solder paste and glue on stencil. For single spraying cleaning meeting poor cleaning effect on the fine mesh, and single ultrasonic cleaning meeting poor cleaning effect on the mass solder paste and glue residue. Comprehensive the ultrasonic cleaning and spraying cleaning, with water-based cleaning agent, with the process including of  first spraying cleaning, precision ultrasonic cleaning, spraying rinsing, and air cutting, drying and other functions, the cleaning effect is excellent, very little agent consumption, low energy consumption, environment-friendly.

Machine characteristics
Efficiently clean fine printing pitch and apertures with the solder paste and glue.
Integrate the function of cleaning, rinsing and drying
Design aim at water-based cleaning process, safety with low running cost.
High-performance liquid circulating filtration system meet filter waste goodly, and keep the cleaning agent bath life longer.
Stainless steel structure, process observation window, practical and beautiful.
High performs parts with low energy consumption.
Controlled by PLC, One-key operation, man-machine friendly.