Specifications
1.excellent rigidity
2.high wear resistance
3.long life and low risk of wavy cutting

Description:
With slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC and Ferrite

Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size)

Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)
Sintered metal powder is used as the bonding agent material to realize strong holding power. As a result, these blades have low blade wear. These blades are ideal for high precision grooving and cutting of electronics parts or optical devices.

Feathers:

1.Minimized blade wear and high cutting ability.

2. High rigidity-minimized wavy and slant cutting.

3. Wide variety of bond types for various applications.

4. Able to precisely control diamond concentration to achieve cutting Quality

Applications:

Electronic parts, Optical devices, Various types of semiconductor

packages, Ceramics, Mono-crystal ferrite, Glass, etc.

For more informations, please contact us!