Product Features
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning.

Features
．Extremely high plasma uniformity.
．No substrate damage by using low energy ions.
．No contamination of substrates and electrodes.
．Special plasma electrode design.
．High density plasma source.
      ※High efficiency plasma.
      ※Well-controlled low ion energy.
      ※Combined chemical reactions and physical bombardments.
．High cleaning efficiency.
．Wide operating condition.
．Multiple processing gases selectivity for surface cleaning and treatment.
．Fully automatic and user friendly.
．High reliability and easy maintenance.
．Customization.

Application Industry
．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic components, electronic components, Packaging before the clean.
．Before printing or adhesive surface roughening or cleaning.