Epoxy Adhesive For Temporary Bonding Of Silicon Rod Cutting
This product contains Component A and Component B: A is epoxy adhesive, B is curing agent. It's widely used for the temporary bonding of silicon rod cutting. 

Features: 
1. Two components: Component A and Component B
2. Room temperature curing. 
3. Colors: Component A is white, Component B is red, it's pink after mixed. 
4. Weight ratio: A: B=1: 1
5. Viscosity before mixed: A is 78000mPas, B is 745000mPas. 
6. Viscosity after mixed: 76000mPas. 
7. High tenacity and bonding strength
8. Fast degumming at high temperature(30minutes in Oven at 200 degree centigrade. )
9. Application: Used for the temporary bonding between glass pane and workpiece 
Plane during the silicon rod cutting. 

Specifications/packing: 
Component A: 5kg/bucket, 64buckets/pallet
Component B: 5kg/bucket, 64buckets/pallet

Our advantages: 
1. Listed company in China (stock code: 30041) 
2. Famous Trademark of China 
3. Top 5 in adhesive industry 
4. With SGS, TUV, RoHS marks 
5. OEM services/small orders are welcome