LED Sapphire Laser Scribing Machine  

Applications :

Mainly used in the LED sapphire substrate wafer cutting  

Technology characters:

1.One-button operaton,fully automatic operation of the dicing process;

2.High-precision linear motion platform, the marble pedestal bearing table,the focal length automatically adjusts the body;

3.Automatic positioning system of the CCD image recognition can be back cut tangent;

4.Anti-coarsening of the visual system;          

5.Software to automatically identify the template,angle correction,automatic contour to find the contour correction        

6.High reliability, low maintenance and operating costs;

7.The dicing process, the software automatically correct bar code reading, production statistics and other features. 

The main technology parameters :