Product Description
A, Purpose and Explanation
Epoxy resin 2121 ab is epoxy resin adhesive cured under the condition of normal temperature and low temperature, good liquidity, natural defoaming, anti-yellowing, no smell. Greenhouse curing or heat curing; Dedicated to the LED module potting glue, jewelry surface glue, nameplate, electronic potting glue, mould filling, and the insulation of other electronic components , moistureproof, potting, confidential encapsulation , etc.
B, The properties before hardening
The main agent2121A Curing agent2121B
Color: Colorless transparent Colorless transparent
Specific gravity: 1.15 0.96
Viscosity25℃: 1000-2000CPS 100MAXCPS
C, Conditions of usage
1)Mixing ratio: A: B = 100:33(weight ratio)
2)Hardening conditions: 25 ℃×8H to 10 H or 55℃×2H (2 g)
3)Usable time: 25℃×40min (100g)
D, Application method
1.Working environment: The container of holding glue please keep clean, A and B part should be in accordance with the weight ratio, weigh accurately , mix fully along the container wall by clockwise and use after 3 to 5 minutes .
2.According to the operational time and dosage of mixing rubber, avoid wasting. When the temperature below 15 ℃, please put A glue to glue again after warm up to 30 ℃, easy to operate, (a glue will be thicken when low temperature ); Must be sealed lid after use, avoid product rejection caused by moisture absorption.
3.When the relative humidity is more than 85%, the curing surface easy to absorb moisture in the air, form a layer of white mist, so when the relative humidity is more than 85%, is not suitable for room temperature curing, s est to use the heat curing.
4. Must be sealed lid after use, avoid product rejection caused by moisture absorption..
E, The properties after hardening
1) Hardness shore D <75
2)Withstand voltage KV/mm 22
3)Flexural strength Kg/mm2 28
4)Volume resistivity Ohm3 1x1015
5)Surface resistance Ohmm2 5X1015
6)Thermal conductivity W/M.K 1.36
7)Induced electric loss 1KHZ 0.42
8)Heat Deflection temperature ℃ 80
9)Moisture absorption % <0.15
10)Compressive strength Kg/mm2 8.4
The above performance data is typical data measured by the laboratory environment under the condition of the temperature of 25 ℃,the humidity of 70%. For customer’s reference only.