Usb flash drive pcba maker for over 10 years experience

Model:	HX-12-233
Brand:	HUA XING
Origin:	Made In China
Category:	Electronics & Electricity / Other Electrical & Electronic
Label:	pcb
Price:	US $1 / pc
Min. Order:	1 pc

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Product Description

Quick Details

Place of Origin: Guangdong, China (Mainland)
Base Material: FR4
Copper Thickness: 1oz
Board Thickness: 1.6mm
Min. Hole Size: 0.1mm
Min. Line Width: 0.075mm=3mil
Min. Line Spacing: 0.075mm=3mil
Surface Finishing: HASL lead free

Packaging & Delivery

Packaging Details:	Vacuum package , ESD package
Delivery Detail:	5-7 days for PCB, around 20 days for PCBA.

Specifications

experienced manufacturer in making usb flash drive pcba. you can call our U.S.office at 310-626-7575.

We are an experienced one-stop shop to serve all your PCB & PCBA needs.

We not only produce the highest quality products, but also provide most excellent service from the time receiving your inquiry to the time delivering the products. We offer no MOQ for all projects, and no sample charges if an order is placed at a later time. We promise quotation response within 24 hours of receving inquiry with all needed information. With the newly opened U.S. office, we are able to shorten the response time even further.

For more information, please visit www.ems-pcba.com.

Technical capacity

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.