Product features
· preprocessing: to be encapsulated surface needs to be cleaned or degreasing treatment, in order to achieve the best sealing effect, recommend the use of DC-1200-OS primer.
· sizing: use manual or automatic device A, B according to proportion (weight ratio) mixed. Sensitive occasions to the gas mixing, in 10 ～ vacuum 20mm mmHg for 5 to 10 minutes of degassing, colloid more degassing time prolonging. The seal was placed to the entrance level, pouring sealant and self leveling.
Curing: This product is cured at room temperature, heating can accelerate the curing, 48 hours at room temperature curing.
Applicable occasions
· low stress protection: solidified into an elastic body, the mechanical vibration and thermal cycling and other harsh environment, protect the components from damage.
No corrosion: addition reaction system, no by-product generated in the reaction process, no volume change, more environmental protection.
· transparency: transparent. Can be applied to transparent, or low optical requirement.
· easy demould: smooth surface, a lower surface energy, easy demoulding.
Method of use
· apply to electronic equipment needs to be low stress. Such as: sensor, PDMS module, Petri dishes, dies.