1.production name :Mobile phone motherboard PCB

2.IPC standar : IPC-A-600G

3.Board thickness :0.2mm-6.0mm

4.Laminate : FR-4,Taconic,Rogers,TG170,TG180,CEM-1.

5.Layers :SS,DS,ML,Single side,Double side,Multilayer,1-24Layer

6.Outer / inner Coppers: 1/1 oz,1/2 oz,2/2 oz,2 oz,3 oz,4 oz.

7.Multilayer stack up :Stack up,controlled impedence.

8.Pcb size :unit size,panel size,tooling strips,tooling holes and fudicials.

9.Min hole size :0.2mm

(Shape tolerance±0.13mm,hole tolerance :PTH±0.075mm ;NPTH :±0.05mm)

10.Min line width :0.1mm

11.Min line spacing :0.1mm

12.Solder mask color :Green,Blue,Red,Black,Yellow,White

13.Legend color :White,Yellow,Black,Blue,Red

14.Surface finshed :HAL(Tin / Lead),HAL(Lead Free),Immersion gold,Immersion Silver,

                   Immersion Tin,Gold Plated(Soft Gold),OSP(ENTEK).

15.Certificate :UL,ISO9001,ISO14001,SGS,RoHS,QS9000.

16.Profiling :CNC,Routing,Punching,Beveling,V-cut,V-score,Counter sink.

17.Test :E-test,Fixture,Fly-test.

18.Special technique :Buried and bling vias,controlled impedance,BGA.

19.Package :Vacuum package,Seal package.

20.Shipping :FOB HongKong,CIF,Air Transportation,DHL,UPS,Fedex.