1.Normal Grade

 

Model no: SMT-DA

 

Property: Regular crystal shape, very concentrated size distribution, round particle shape near to ball, tiny impurity, fine dispersion and abrasive resistance.

 

Usage: Making PCD, metal bond, vitrified bond, coated product, grinding and polishing precision instrument, optical glass, fine ceramic, diamond, semiconductor and so on.

 

Available size:

W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60

 

Model no: SMT-DB

 

Property: Relatively regular crystal shape, concentrated size distribution, regular partial shape, low impurity.

 

Usage: Cutting, grinding, polishing silica and optical glass, ceramics and so on.

 

Available size:

W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60

 

Model no: SMT-DC

 

Property: irregular crystal shape, size distribution under national standard.

 

Usage: Grinding and polishing PDC sintered body, ceramics and stone.

 

Available size:

W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60

 

 

2.High Grade

 

Model no: SMT-HA (High Strength)

 

Property: Good diamond with high strength and high purity as raw material, with regular crystal shape, concentrated size distribution, tiny impurity, high thermal stability and high abrasive resistance.

 

Usage: Used in PCD, metal bond, vitrified bond; grinding and polishing semiconductor, optical glass, fine ceramics, diamond, precision bearing, seal components; producing diamond abrasive paste.

 

Available size:

W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60

 

Model no: SMT-HB (Super Fine)

 

Property: Mono-crystal diamond powder with good quality diamond as raw material, with advanced selecting techniques, under submicron and nanometer size.

 

Usage: Grinding, polishing and fine processing in super hard and brittle material such as fine ceramics, integrated circuit chip, diamond, quartz; as additive for wearable composites, composite coating and lubricating material. Widely used in aerospace, precision mechanism, optical instrument, automotive industry as ideal polishing material.

 

Available size:

W0-0.05,W0-0.1,W0-0.125,W0-0.2,W0-0.25,W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60

                                                           

Model no: SMT-HC (Super Pure)

 

Property: Adopted good quality MBD series diamond as raw material, by special purifying process, to ensure clean particle surface, impurity under PPM; with fine stable dispersion and suspension under water and oil based condition after special surface modifying treatment, to ensure the efficiency of grinding and polishing; concentrated size distribution, super high equivalent shape, fine heat resistance and abrasive resistance.

 

Usage: For PDC, lapping liquid; grinding, lapping and polishing material under special surface processing.

 

Available size:

W0-0.05,W0-0.1,W0-0.125,W0-0.2,W0-0.25,W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60

 

 

3.Special Use

 

Model no: SMT-SA (For PDC)

 

Property: Good quality MBD series diamond with high strength as raw material, by special process and particle surface cleaning treatment; with regular crystal, good heat stability and abrasive resistance, good for sintered growing of PDC and PCD.

 

Usage: For PDC, PCD, wire drawing die, coated abrasives, ceramics, metal bond abrasives.

 

Available size:

W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60

 

Model no: SMT-SB (For Abrasive Brick)

 

High quality diamond as raw material, by special processing, with irregular particle shape and multi-edge with high sharpening performance. Promoting wear resistance and extending working life.

 

Usage: Making abrasive brick of diamond resin binder.

 

Available size:

W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60

 

Model no: SMT-SC (For Wire)

 

Property: MBD series diamond with good quality and high strength as raw material, by special reshaping, selecting processing, no big size. With better crystal, concentrated size distribution, promoting abrasive ability by increasing the number of efficient grinding particle.

 

Usage: For cutting equipment production such as wire saw; for coarse and fine grinding, polishing in new hard and brittle material such as monocrystal silicon, polycrystal silicon, diamond, quartz, LCD, magnetic material, semiconductor.

 

Available size:

W0-0.5,W0-1,W0.5-1,W0.5-1.5,W0-2,W1-2,W0.5-3,W1-3,W1.5-3,W2-3,W2-4,W2-5,W3-6,W3-7,W4-8,W4-9,W5-10,W5-12,W6-12,W8-12,W8-16,W8-20,W10-20,W12-22,W12-25,W15-25,W20-30,W22-36,W20-40,W30-40,W30-50,W36-54,W40-50,W40-60