Made of bronze or resin binder two kinds. Mainly used for the following cutting processing industry.

Magnetic materials, ferrite and various kinds of magnetic materials

Ceramic materials:

Semiconductor materials:

Metal materials:

Other materials:

Specification: diamond grain size: 80 #, 600 #

Thickness (T) : 0.4 mm - 2.0 mm

Inner hole: (H) : 12.7 mm - 76.2 mm

Features: high strength, strong resistance to damage, high cutting precision, sharp, cutting efficiency is high.