Semiconductor Glass Wafers

Gking Glass Co.,Ltd provides a variety of glass wafer for a wide range   
application such as MEMS , anodic bonding , sensor , display glass , optical 
and precision engineering . These glass wafers can be provided in round or 
square shape , thickness range from 0.1,0.3 , 0.5 , 0.7 , 1.1 to 3 mm , primary flat 
can be provide as SEMI. standard , non- standard thickness and finish are     
also available. We have glass substrate in stock and can machine to your       
specification with high quality finish . Contact us for further information on        
price and delivery time

Introduction:

       Company focused on the glass surface thinning and polishing, the introduction of domestic and foreign advanced chemical thinning and physical polishing equipment, continuous exploration and innovation, and gradually formed a thinning polishing technology with their characteristics, can provide customers with Asahi Glass(AGC), Central Glass, NSG glass, Corning glass, SCHOTT ultra-thin glass thinning polishing, conventional size: 400´500mm,370´470mm,450´550mm,other specifications can be customized, can provide OEM services.Products are exported to Europe, Japan, South Korea, the United States, Taiwan and other places, are widely used in the device, LCD, smart phones, the paster, protection panel, touch panel, and other fields.

 AGC glass Technical indicators:

a)Thickness:0.15mm,0.2mm,0.26mm,0.28mm(Can be customized non-standard thickness)

b)Size:370´470mm,400´500mm,450´550mm(Can be customized non-standard size)

c)TTV:Φ500 range ±0.01mm

d)Thickness tolerance:±  0.02mm