1、The definition of COG bonding machine（pre-press） XCG73-A1 :

COG bonding equipment (Preload) referred to as "bonding machine," "hot-press", COG bonding equipment is to determine the IC chip on top of LCD glass finishing and binding equipment, machine controlled by a PLC + HMI composition core products in the completion of the bits and transmitted by the platform after Preload pressure to bind The crimp. Using ACF (Anisotropic conductive adhesive) by pressing the IC bonding directly to the LCD screen. After bonding the entire module is also through FPC (flexible printed circuit board) metal pin and PCB board connector together. LCD screen, ACF, the driver IC are the three key components of COG. 

2、The alternative name of COG bonding machine（pre-press） XCG73-A1 ：

According to the different application and promotion of COG bonding equipment（pre-press） XCG73-A1   ,they are many keywords:Bonding machine, pressing machine, COG pressing machine, COG bonding machine, LCD screen repair machines, COG pressing equipmentthermostat bonding machine, constant temperature hot bonding machines, small and medium-size LCD screen bonding machine, LCM Pradesh machines, modular hot bonding machine, LCD COG bonding machine, cable bonding machines, cable bonding equipment, COG pressure IC devices, COG thermostat pressing machine, COG IC thermostatic pressure machine, COG thermostat The laminate machine,LCD IC  pressing machine , COG thermostatic pressing equipment, COG thermostatic pressure IC devices, COG bonding machine customization process, COG crimping machine, COG thermostatic The pressure equipment,, IC bonding machine , IC bonding equipment, IC pressing machine, LCD bonding machine, modular bonding machines, LCD bonding machine, LCD screen pressing machine, LCD pressing machine, COG heated process equipment, COG thermostatic pressure IC devices, IC constant temperature bonding machine, IC thermostat bonding equipment and so on.

3、About the classification of COG bonding machine（pre-press） XCG73-A1 

1, Classified according to  function
1.1 Unilateral single IC bonding
1.2 Multilateral multiple IC bonding
1.3 unilateral multiple IC bonding 
2,Classified according to degree of automation
2.1 Semi-COG bonding equipment (Preload)
2.2 Automatic COG bonding equipment (Preload)
3,Classified according to the COG technology:
3.1 preload
3.2 Pressure
3.3 preload and Pressure
4.Classified according to stage work:
4.1 stage X-Y-θ-axis micrometer manual adjustment
4.2 stage X-Y-θ-axis motor to automatically adjust DD
5, Classified according to procedure combinations:
5.1 ACF + COG Preload
5.2 ACF + COG + COG Preload The pressure
5.3 Cleaning + ACF + COG + COG Preload The pressure
5.4 Cleaning + ACF + COG Preload pressure + + COG The particle detector 

4、About the application field of  COG bonding machine（pre-press）XCG73-A1：

COG bonding equipment (Preload) is widely used in a variety of LCD display (LCD), modules (LCM) and large-sized display panel production, assembly, maintenance, production enterprises; such as: mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises. 

5、About the working principle of COG bonding machine（pre-press） XCG73-A1   ：

COG bonding equipment （pre-press） XCG73-A1    is to use head pressure, pressure head temperature, bonding time, optical alignment system ACF bonding glue FPC, COF and the LCD and PCB board ,so that it can conduct electricity.

6、About the COG bonding machine（pre-press） XCG73-A1    's competitive advantage： 

6.1 SUNSOM patent (Patent No. ZL201120120232.2): SUNSOM pressure system cylinder head structure can eliminate weight, pressure accurate.
6.2 thermostatic heating curve with digital temperature display synchronization, the thermocouple output parameters can be adjusted according to the head power.
6.3 Imported PLC controller, can store 500 groups of function parameters.
6.4 The system can automatically store the location of each IC, the operation may need to go to repair the IC automatically position.

7、About the basic parameters of  COG bonding machine（pre-press） XCG73-A1: 

Input Power: AC220V 50-60HZ
Rated power: 1.5KW
Temperature range: RT-500 ℃;
Working pressure :0.4-0 .8 MPa
Product registration adjustment: X.Y.θ
Fine-tuning; gas consumption: ≈ 50L/min;
Bit mode: CCD next bit;
Indenter size: (can be selected)
Thermocouple: K type
Pressure Unit: Kg / N / Mpa / Kpa interchangeable;
Program control: PLC controller
Heating: heating thermostat
Operating modes: 7-inch HMI 

8、About the functions and characteristics of the COG bonding machine （pre-press） XCG73-A1

8.1 heating curve with digital temperature display synchronization.
8.2 can store 500 groups of function parameters.
8.3 thermocouple output parameters can be adjusted according to the head power.
8.4 SUNSOM twin eliminate structural weight, pressure accurate.