Fucun's Hot Bar Bonding & Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB.

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• Microprocessor-based controller provides precise and consistent temperature control.
   
• Unique pulsed heat thermode offers uniform temperature distribution, fast heating and cool-down.
   
• Flexible programmable profiles for targeted idle, preheat and reflow temperature.
   
• Floating thermode and digital pressure control.

• Manual shuttle of work; optional pneumatic shuttle.

• NEW:  Bonder machine uses conductive adhesive film (ACF) for very fine pitch devices.  Click here for larger image.