1-Hydroxy Ethylidene-1,1-Diphosphonic Acid

(HEDP) CAS No. 2809-21-4
                            Molecular Formula: C2H8O7P2  
         Molecular weight: 206.02 Synonyms: Dequest 2010;
Etidronic AcidStructural Formula:

Properties:
        HEDP is an organophosphoric acid corrosion inhibitor. It can chelate with Fe, Cu, and Zn ions to form stable chelating compounds. It can dissolve the oxidized materials on these metals’ surfaces. It shows excellent scale and corrosion inhibition effects under temperature 250℃.
        HEDP has good chemical stability under high pH value, hard to be hydrolyzed, and hard to be decomposed under ordinary light and heat conditions. Its acid/alkali and chlorine oxidation tolerance are better than that of other organophosphoric acids (salt).
        HEDP can react with metal ions in water system to form hexa-element chelating complex, with calcium ion in particular. Therefore, it has good antiscale and visible threshold effects. When built together with other water treatment chemicals, it shows good synergistic effects.
        Solid HEDP is crystal powder, suitable for usage in winter and freezing districts. Due to its high purity, it can be used as cleaning agent in electronic fields and as additives in daily chemicals.

Specification:

Usage:
        HEDP is used as scale and corrosion inhibition, often build with polycarboxylic acid, in circulating cool water system, oil field and low-pressure boilers in fields such as electric power, chemical industry, metallurgy, fertilizer, etc.
        In light woven industry, HEDP is used as detergent for metal and nonmetal. In dyeing industry, it is used as peroxide stabilizer and dye-fixing agent; In non-cyanide electroplating, it is used as chelating agent.

Package and Storage:

Liquid: 200L plastic drum, IBC(1000L), customers’ requirement.
        Solid: 25kg/bag, customers’ requirement.
Storage for ten months in room shady and dry place. Safety Protection:
        Acidity, Avoid contact with eye and skin, once contacted, flush with water.