SMT Motherboard PCB Assembly

SMT Motherboard PCB Assembly
Model:JPX-H-010
Brand:OEM
Origin:Made In China
Category:Electronics & Electricity / Electronic Components / Circuit Board
Label:PCB Assembly , Lead-free HAL PCB , Multilayer PCB
Price: US $4.65 / pc
Min. Order:10 pc

Product Description

  • Specifications:
    • Layers: 4
    • Material: FR-4
    • Finishing board thickness: 1.2mm
    • Hole dimensions: 0.2mm
    • Minimum width/spacing: 3/3-mil
    • Finishing board copper thickness: 1oz (35um)
    • Certificates: UL, SGS, RoHS
  • Packaging:
    • Inner: vacuum packaging/plastic bag
    • Outer: carton or according to your requests
    • Lead time: from 3 days to 4 weeks or according to customer's requests
  • If you need PCB assembly service, could you give us following information:
    • Gerber file of the bare PCB board 
    • BOM (bill of material) for assembly, to shorten the lead time, please kindly advise us if there is any acceptable components substitution
    • Testing guide and test fixtures if necessary 
    • Programming files and programming tool if necessary 
    • Schematic if necessary
Manufacture capability:  
Layers: 1-24
Materials: FR-4, FR-5, aluminum base
Surface finishing: Immersion gold, OSP, HAL with lead, lead-free HAL, carbon ink
Finishing board thickness: 0.2-4.8mm
Minimum hole dimensions: 0.2mm
Minimum width/spacing: 3/3-mil
Finishing board copper thickness: 1-6oz (35-210um)
Maximum panel dimensions: 750 x 850mm
Hole dimensions tolerance: PTH: ±0.075mm
NPTH: ±0.05mm
Outline tolerance: ±0.1mm
Warp and twist: 0.7%
Impedance control tolerance: ±5%
Solder mask colors: Green/blue/red/black/yellow/white or as per your requests
Payment Terms:TT/LC
SMT Motherboard PCB Assembly 1SMT Motherboard PCB Assembly 2SMT Motherboard PCB Assembly 3SMT Motherboard PCB Assembly 4SMT Motherboard PCB Assembly 5

Member Information

Shenzhen Jingpinxin Electronics Co.,Ltd
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:18025844639
Contact:Helen (Sales manager)
Last Online:29 Jun, 2015