Product Description:

HC Series Silicon thermal conductive pad is high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering.According to the different needs of customers to cut into various types of soft silicon film

Product Features:

* Excellent thermal conductivity

* Self-adhesive, natural sticky, no extra surface added adhesives

* Soft and flexible

* SGS

Product Application:

* Communication Equipment

* LED lighting

* Switch power supply

* Backlight module

* Medical equipment

* Mobile equipment

* Video equipment

* Networking equipment

* Household equipment

* PC server/ workstations

Application Modes:

* Filling between PCB and heat sink

* Filling between IC and heat sink or product outer covering

* Filling between IC and other cooling devices
 

Color                      Varied  
 Thickness              0.3~12±10% mm
SpecificGravity       1.7+0.1 g/cm3 
    Hardness            30±5 Shore C
Continuous Use Temp -40~+220 ℃
Dielectric Breakdown Voltage            ≥6 Kv
Dielectric Constant                            ≥5.5 ℃-in2/W 
 Vloume Resistivity                            >1.2×1011 Ω.cm
Flame Rating                                       V-0
Thermal Conductivity                        1.7- 4.0 W/mk