Analog Technologies, Inc. (ATI)

wei.tan@analogti.com

+86 18045337355

www.analogti.com ;www.ananlogtechnologies.com

ATI(Analog Technologies, Inc.)
2352 Walsh Ave. 
Santa Clara, CA 95051
U. S. A

Tel.: 408-748-9100
Fax: 408-748-9111
 

Thermal conductive materials play an important role in temperature control systems. There are two types of thermal conductive materials including thermal conductive pad and thermal conductive epoxy encapsulation.

Thermal Conductive Pad

We have a series of thermal conductive pads, ATCR1R5 series. This series thermal conductive pad is a special compound formed by mixing the silicon gel flour and the ceramic flour. This pad has natural weak adhesion on both sides and presents good thermal conductivity and electrical insulation under low pressure. ATCR1R5 series can work stably at -40-150ºC. The flame rating is UL94 V0.

1. Thermal conductivity: 1.5W/m.k

2. Low pressure applications

3. Natural tack

4. Electrical insulating

5. High temperature resistance

6. 100 % Lead (Pb)-free and RoHS Compliant