1~ 3W emitter

Ultraviolet (UV) 1~3W emitter package product data sheet

 

 

Feature                                             

  1W 3535VT Al2O3 Ag-plating Ceramic Package                  

  Half Angle (2θ1/2) : 125°                                                 

 Silicone Compression Molding Lens                                 

  Vertical Chips                                                                

 

 

 

 

Notes :

 

1. All dimensions are in millimeters 

 

2. Tolerance is ±0.25mm 

 

 

 Electrical/Optical Characteristics (Ta=25°C)

 

 

 

Parameter	Symbol	Conditions	Min.	Avg.	Max.	Units
Radiant Flux	Φe	IF=350mA	15		600	mW
Peak Wavelength	WLP	IF=350mA	365		430	nm
Forward Voltage	VF	IF=350mA	2.8		4	V
Thermal Resistance Junction To Board	RthJ-B	IF=350mA		13		℃/W
Temperature Coefficient of Forward Voltage	(Theta)VF/(Theta)T	IF=350mA		2		mV/℃
Reverse Current	IR	VR=5V			10	μA
Viewing Angle[1]	2θ1/2	IF=350mA	130	140	150	Deg

 

 

 

 AbsoluteMaximum Rating (Ta=25°C)

 

 

 

Parameter	Symbol	Ratings	Units
Power Dissipation	PD	3	W
Continuous Forward Current	IF	700	mA
Peak Forward Current [2]	IF(Peak)	1000	mA
LED Junction Temperature	TJ	120	℃
Reverse Voltage	VR	5	V
Operating Temperature Range	TOPR	-30℃ To  +80℃
Storage Temperature Range	TSTG	-40℃ To  +100℃
Manual Solding Temperature	TSOL	260℃±20℃ For 3-5 Seconds
ESD Sensitivity	ESD	2000V HBM

 

Notes:

 

[1]. Tolerance Θ:10degrees,

 

[2]. 1/10 Duty Cycle 0.1ms Pulse Width.

 

 

 

Ultraviolet (365-400 nm) Spectrum Distribution

 

 Characteristic Curves

Luminous flux (Φe) vs Current(IF)       

 

Current(IF) vs Voltage(VF)

 

Typical Radiation Pattern

Typical Reflow Soldering Profile

 

l  Reflow Soldering Temperature Profile

 

Profile Feature	Typical parameters
Average Ramp-Up Rate (Tsmax to Tp)	3 °C/second max.
Preheat Temperature Min (Tsmin)	150 °C
Preheat Temperature Max (Tsmax)	200 °C
Time (Tsmin to Tsmax)	60-180 seconds
Time maintained above Temperature (TL)	217 °C
Time maintained above Time (TL)	60-150 seconds
Peak/Classification Temperature (Tp)	240 °C
Time within 5 °C of Actual Peak Temperature (Tp)	5 seconds
Ramp-Down Rate	6 °C/second max.
Time 25 °C to Peak Temperature	8 minutes max.

 

 

(Tape-and-Reel Packing) 

 

 

 

Notes :

1. All dimensions in millimeters

 

Notice

 

1. In order to avoid absorption of moisture, it is recommended that the products are stored in the dry box (or desiccators ) with a desiccants. Alternatively the following environment is recommended:

 

Storage temperature : 5°C~30°C Humidity:60% HR max.

 

2. If the storage conditions are of high humidity the product should be dried before use.

 

Recommended drying conditions: 12 hours at 60°C±5°C.

 

3. Any mechanical force or any excess vibration should be avoid during the cooling process after soldering.

 

4. Reflow rapidly cooling should be avoided.

 

5. Components should not be mounted on distorted Printed Circuit Boards.

 

6. Devices should not contact with any types of fluid, such as water , oil , organic solvents…. etc.

 

7. The maximum ambient temperature should be taken into consideration when determining the operating current.

 

8. Devices should be soldered within 7 days after opening the moisture-proof packing.

 

9. Repack unused product in anti-moisture packing, fold to close any opening and store in a dry place.

 

10. The appearance and specifications of devices may be modified for improvement without notice.

 

11. ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist bands or anti-electrostatic gloves be used when handing the LEDs . All devices, equipment and machinery should be properly grounded.

 

12. This product must be driven by constant power supplier