Standard Features:

• Cost Effective Process
• User Friendly, Self Teach, Flexible Software
• Windows Based User Interface
• High Speed Defect Detection
• 100% Device Inspection
• Random or Fixed Sample Inspection with Programmable AQL
• Customized Inspection
• Ultra High Resolution Cameras and Optics
• Custom Programmable LED Lighting
• Yield, Defect, Machine, Product Type Data Collection Center (DCC)
• Standard or Customer defined Reporting
• Expandable
• Pass Fail Mode FASTEST UPH MODE
• Measure, Code Read, Correlate, Data Collect Mode*

                 *UPH Dependant on Wire Count, Measurements, Inspection Criteria etc

 Standard Inspection Capabilities:

• Missing Die
• Missing Wire / Misplaced Wire
• Wire Shorts
• Wire Breaks
• Ball Measurement
• Wire Measurement
• Wire Sag / Track
• Die Attach Wetting
• Epoxy Check. On Die or Lead
• Chipped or Crack Die
• Die Scratch
• Die Orientation
• Correct Die
• Theta Check
• Die Location
• Correct Wire Bond Location Verification
• Wire Bond Mapping
• Multi Die Verification / Missing Component on MCM's
• Ink Dot
• Foreign Particles
• Measurement
• Serial / Part Numbers / Bar Codes / Device Codes .