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Origin: | - |
Category: | Electronics & Electricity / Electronics Stocks |
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Flex, rigid flex, and rigid PCB form factors
SMT, through-hole, and mixed technology Board sizes up to 18” x 14” Complex, high density assemblies PBGA, CBGA, TBGA, FPGA, CGA, LGA Package on Package (PoP) assembly Micro BGA (0.4mm) 0402s, 0201s, 01005s Wave and selective solde http://www.hemeixinpcb.com |
Hemeixin Electronics Co.,Ltd | |
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Country/Region: | Guang Dong - China |
Business Nature: | Manufacturer |
Phone: | 27586529 |
Contact: | wangli (jingli) |
Last Online: | 08 Dec, 2015 |