Technical Capability

Board Type

FR-4，CEM-3，Special material (high-frequency board, cu-base board, aluminum-base board, ceramic-base board)

Board Thickness

0.17-5.0mm（7-127mil）

Max Size

500mm × 1200mm

Layer

2 - 16

Min.Line/Space

0.075mm/0.075mm(3mil)

Impedance

±10%

Cu Thickness

1/3 OZ-6 OZ

Min. Finished HoleSize

0.15mm(6mil)

Drilling Hole

0.15mm - 6.5mm (6-165mil)

S.M.Bridge

0.075mm(3mil)

Aspect Ratio

8：1

Surface Finish

LF HASL, Immersion gold, Immersion Tin, OSP

S.M. color

Green, yellow, red, black, white, blue etc.

Registration Tolerance

±0.05mm

Routing Appearance Tolerance

±0.10mm

Drawing Appearance Tolerance

±0.10mm

V-CUT degree of alignment

±0.10mm

Copper hole tolerance

±0.075mm

Non-copper hole tolerance

±0.05mm

The degree of alignment between layers

±0.05mm

Alignment of the solder

±0.05mm

Max. test point

10,000

Min.IC

0.20mm

Min.BGA

0.25mm

HDI

（1+N+1）

SMT Capability

Mount Range

01005～32mm       Chip、SOP、QFP、CSP、BGA…

Mount Accuracy

±0.05mm

Repeat Accuracy

±0.03mm

Min.Board

L50mm*W50mm

Max.Board

L510mm*W460mm

Mount Board Thickness

0.2mm—3.5mm

Technical Capability

Lead/Lead-free etc.