For the electronics industry, the humidity hazards have become one of the main factors of product quality control. According to statistics, there are more than 1/4 of the global industrial production of bad products and the harm of the wet.
Wet one of the dangers of the PCB in penetration and attached to the IC's internal moisture, in SMT process of heating section formed water vapor, generated pressure causes the IC resin package cracking, and IC device has an internal metal oxidation, resulting in product failure.
PCB and electronic equipment in the process of storage will also be the harm of moisture. Such as in the environment with high humidity storage time is too long, will lead to moisture infiltration substrate caused by failure, or the metal oxidation leads to poor contact failure.