high temperature solder paste lead free eco solder paste for SMT solder machine
| Model: | sac305 sodler |
|---|---|
| Brand: | BBIEN |
| Origin: | Made In China |
| Category: | Industrial Supplies / Machinery / Welding Solders |
| Label: | solder paste , sac305 sodler paste , eco solder paste |
| Price: |
US $2
/ pc
|
| Min. Order: | 20 pc |
Product Description
SAC305 high temperature solder paste
BBIEN'S SAC305 silver solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies.
Chemical compositions
|
Sort |
Chemical composition (wt.%) | ||||||||
| Sn | Ag | Sb | Cu | Bi | Zn | Fe | Al | Cd | |
| Sn96.5-Ag3.0-.Cu0.5 | Bal. | 3.0+/-1 | <0.010 | 0.5±0.1 | <0.010 | <0.003 | <0.02 | <0.002 | <0.002 |
Physical Speciality
Sort |
(℃)
Melting Point |
g/cm3
Spec. Gravity |
MPa
Tensile Strength |
| Sn96.5-Ag3.0-Cu0.5 | 217-219 | 7.50 | 53.3 |
Powder size:
| MESH SIZE | MICRONS SIZE | Particular type |
| -200+325 | 75-45μm | 2 |
| -325+500 | 45-25μm | 3 |
| -400+635 | 38-20μm | 4 |
| -500 | 25-15μm | 5 |
| -635 | 15-3μm |
6/7
|
Feature of Sn96.5Ag3.0Cu0.5 solder paste:
1.Halogen-free per IPC definition.
Capable of 01005 print and reflow, even in air reflow environment.
2.Can print down to 8 mil x 8 mil apertures.
3.Designed specifically for fine feature printing with T4 powder
4.Low QFN/BGA voiding.
5.Excellent solderability with halogen-free chemistry.
6.Optimized flux residues to mitigate head-in-pillow defects Capable of print speeds up to 6 in/sec (150mm/sec).
7.Low slump behavior minimizes defects.
Other kinds of solder paste
Description:Sn96.5Ag3.0Cu0.5 solder paste
BBIEN'S SAC305 silver solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies.
This paste was formulated to replace traditional rosin/resin based no-clean formulations with more reliable synthetic materials. The residue is pin probable for ICT inspection.
Although BBIEN SAC305 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents.
Temperature chart
Testing datasheet for SAC305 paste
| Item | Specification | Standard |
| Appearance | Gray paste w/o visible foreign matter and clusters | |
| Alloy composition | Sn/Ag3.0/Cu0.5/x | JIS-Z-3282 |
| Melting Point | 217-219 °C | |
| Particle Size | (Type 3) +45μm < 1%, —20μm < 10%
(Type 4) +38μm < 1%, —20μm < 10% (Type 5) +25μm < 1%, —15μm < 10% (Type 6) +15μm < 1%, —5μm < 10% |
IPC-TM-650,2.2.14 |
| Powder Shape | Spherical | |
| Flux Content | 11 ± 1.0wt% | JIS-Z-3197, 8.1.2 |
| Viscosity | 200 ± 30 Pa s (25±1 C°, 10rpm,Malcom ) | JIS-Z-3284, Annex 6 |
| Flux Type | ROL1 | J-STD-004B |
--Test Content--
| Test Item | Test Result | Test Method |
| Copper Plate Corrosion Test | Pass | JIS-Z-3197, 8.4.1 |
| Spread Test | > 75% | JIS-Z-3197, 8.3.1.1 |
| Copper Mirror Test | Pass | IPC-TM-650, 2.3.32 |
| Viscosity Test(25 °C,10rpm) | 200 ± 30 Pa • s | JIS-Z-3284. Annex 6 |
| Tackiness Test (gf) | > 130 (8hr) | JIS-Z-3284. Annex 9 |
| Slump Test | Pass | JIS-Z-3284. Annex 7, 8 |
| Solder Ball Test | Pass | JIS-Z-3284. Annex 11 |
--Reliability Test--
| S.I.R. Test ◊ | > 1×109 Ω , Pass | IPC-TM-650, 2.6.3.3 |
| Electro Migration Test ♦ | Pass | IPC-TM-650, 2.6.14.1 |
◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
--Alloy Composition--
| (Sn) | (Ag) | (Cu) | (Ni) | (Ge) | (Zn) | (Al) | (Sb) | (Fe) | (As) | (Bi) | (Cd) | (Pb) |
| REM. | 2.8~3.2 | 0.3~0.7 | 0~0.01 | 0~0.01 | 0.001 MAX | 0.001 MAX | 0.05 MAX | 0.02 MAX | 0.03 MAX | 0.10 MAX | 0.002 MAX |
0.05 MAX |
Packing
solder paste could be classified as can/bottle packing and syringe packing type.
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
| Specification | Sn96.5Ag3.0Cu0.5 |
| Appearance | gray tacky paste |
| Weight | 500g/jar or 100g/syringe；10kg/carton
|
shenzhen bbien technology is solder manufacturer in china,our product line includeinclude solder wire,solder paste,solder power,solder bar, flux, red glue,and so on , please feel free contact us .
Member Information
| shenzhen bbien technology co.,ltd | |
|---|---|
| Country/Region: | Guang Dong - China |
| Business Nature: | Manufacturer |
| Phone: | 6852840 |
| Contact: | Richard (sales manager) |
| Last Online: | 08 Mar, 2016 |
