solder paste is a design for today's SMT production process no-clean solder paste. Minimal amount of oxidation using lead-free alloys and inactive better help paste formulated, viscosity can meet the printing and dispensing technology, wide range of applications.

 

★adapt to a variety of electronic circuit boards installed linking the various sectors of lead-free soldering processes.

★adapt to a variety of lead-free solder dip tin or components.

★but also for a variety of special process of welding.

★It also can be deployed to meet customer production of lead-free solder according to the customer's actual production.

 

Benefits:

★Using a dedicated help paste formulation which very little residue, and the light color.

★weldability strong, good welding can be welded in a variety of coating surface.

★choose a variety of packaging: copper needle type and canned.

★can adjust for special welding flux paste.

Product alloy composition and physical properties

 

Currently there are lead-free solder SnCu, SnAg, SnAgCu, SnCuNi, SnBi other alloying ingredients dispositions.

 

 

Model SAC305 SBi58 SAC305 SBi58 SAC305 SBi58

Alloy composition SnAg3Cu0.5 SnBi58 SnAg3Cu0.5 SnBi58 SnAg3Cu0.5 SnBi58

A melting point of 217℃138℃217℃138℃217℃138℃

Tin powder particle size 20-45um 20-45um 20-63um 20-63um 20-63um 20-63um

Metal content 89% 89% 89% 89% 89% 89%

Viscosity (Pa_S) 180-220 180-220 160-200 160-200 160-200 160-200

General purpose SMT SMT plug Universal LNB LNB plug radiators for radiators for

Packaging: plastic bottles, 0.5 kg / bottle.

1. Good quality, excellent wettability.

2. There is a wide range of application areas, we can specialize in manufacturing mobile phones, laptop computers, digital cameras and other high-end electronics manufacturing complex.

3. weldability strong, good welding can be welded in a variety of coating surface.

The excellent wettability for easy on tin plate products have excellent effect on the tin.

5. Can be used in precision manufacturing, such as: connectors, QFN, QFP high-precision manufacturing.

Performance:

 

1. Printing rolling off the tin and good, up to 0.3mm pitch pads can also complete the fine print (T6);

2. When the continuous printing, the viscosity changes very little, long-life steel operatively online, more than 12 hours is still not become dry, still maintain good printing results;

3. After printing a few hours remain the original shape, almost no collapse, no SMD components offset shift;

4. has excellent welding performance, in different parts of the exhibit appropriate wettability;

5. Can adapt to the requirements of different grades of welding equipment, welding without complete under nitrogen environment, in a wide range of reflow oven can still perform well weldability. With "warming --- insulation" or "gradual warming formula" categories oven setting mode can be used;

6. very little residue after soldering, the color is very light and has a large insulation resistance, will not corrode PCB, disposable requirements can be achieved;

7. ICT test has better performance, no miscarriage of justice;

8. Designed for BGA product formulations, solve welding BGA aspects of the pro