Thermal Conductive Silicone Encapsulant

1. Quick details

Place of Origin: Guangdong,China                Model Number: JRF GM800-02 

Brand Name: JRFT                                        Other Name: Thermal silicone encapsulant                  

Classification: Other Adhesives                      Main Raw Material: Silicone             

Usage: Electronic components                       Density: 1.85±0.05

Viscosity: 4500±1500                                    Hardness: 50-60

Thermal Conductivity: 0.8W/m-k                    Mix Ratio: 1;1     

2. Features

  (1).Easy to operate: choose artificial sizing or mechanical sizing; without use additional primer coating.

     (2). Bonding material widely: can be applied to PC (Poly-carbonate), ABS, PP, PVC etc. other materials and the surface of metal.

(3). Operational time: at room temperature, operation time within 240 minutes, especially for the use of automatic production line, improve the work efficiency and save production cost;

   (4).Strong weather resistance : anti - ultraviolet radiation, aging resistance, anti - ozone, moisture proof, waterproof, resist to salt atmosphere, mold etc., can work in the harsh natural environment .

   (5). Temperature resistant performance: high and low temperature resistance , good ageing resistance. After curing in the wide temperature range (60 ~ 200 ℃) to keep the rubber elasticity.

   (6). Flexible glue film: no shrinkage during curing, excellent toughness of the elastomer is formed after curing, absorb vibration and shock, good impact resistance, good cushioning effect, for electronics, electrical appliances, glass and other fragile products, to provide excellent resistance to shocks and reliability.

    (7).With excellent electrical properties: excellent insulating performance, thermal conductivity, heat dissipation, anti-shock, corona resistance, anti-electric leakage and chemical mediator resistance performance, so for electronics, electrical appliances and other products can provide protection, sealing and insulation functions.

3. Applications

(1). IC potting

(2). electronic watches

(3). calculators

(4). computers

(5). LCD modules

(6). semiconductor components and

(7). COB bonding

4. Attention

When using, please respectively stir two kinds of encapsulants well, and then mix them together, and stir well