BM500 Bonding Silicone Rubber Sheet with silicone as carrier, through adding high performance nano material and heat conduction material made into by thin material flattener. It has excellent thermal conduction performance, excellent heat resistance and  surface antistatic property . Completely replace the Shin Etsu HC series, HC-A series, HC-DS series in performance.

BM500 used in various types of display screen hot-press binding technology, put it on the bottom surface of thermal head , have a buffer effect on temperature, so that the temperature is uniform,  isolation hot pressed products in direct contact with the thermal head, also has to prevent isolation protective effect of electrostatic leakage.

Applications:
1.ITO conductive glass
2.Electronic, electrical appliances
3.Flexible board (FPC)
4.Insulating thermal conduction semiconductor
5.Thermal conductive film, ACF heat pressing engineering
6.Thermistors and temperature sensors

Material composition:
◆Silicone rubber, fiberglass cloth etc.
◆High performance nano materials and heat conduction materials

Features:
◆Thermal resistance : 0.63 ℃ -in2/W (@ 50psi)
◆low fastening pressure
◆Surface smooth and highly adapted
◆Electrical insulation