Two-part; thermally conductive, room temperature or heat cure; minimal shrinkage; no exotherm during cure; no solvents or cure by-products; deep section cure; repairable; good dielectric properties; cures to a flexible elastomer

Two-part Thermally Conductive Silicone Encapsulant for Electronics 905 is manactured by full-automatic producrtion line with capacity (1,000,000 kg/month). Plants locate in DAYAWAN, HUIZHOU, GUANGDONG, CHINA

Potential Uses

• General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, relays
• Adhesive/ encapsulant for solar cells
• Optical applications requiring high refractive index encapsulating
• Applications requiring high thermal conductivity and/or good primerless adhesion